Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system

ABSTRACT

An ultrasound transducer arrangement ( 100 ) is disclosed comprising a plurality of substrate islands ( 110, 120, 130 ) spatially separated and electrically interconnected by a flexible polymer assembly ( 150 ) including electrically conductive tracks providing said electrical interconnections, said plurality including a first substrate island ( 110 ) comprising a plurality of ultrasound transducer cells ( 112 ) and a second substrate island ( 120 ) comprising an array of external contacts for connecting the ultrasound sensor arrangement to a flexible tubular body including a coaxial wire assembly ( 200 ) comprising a plurality of coaxial wires ( 220 ) each having a conductive core ( 228 ) covered by an electrically insulating sleeve ( 226 ); and an electrically insulating body ( 210 ) having a first main surface ( 211 ), a second main surface ( 213 ) and a plurality of through holes ( 212 ) each extending from the first main surface to the second main surface and coated with an electrically conductive member, wherein each coaxial wire comprises an exposed terminal core portion mounted in one of said though holes from the first main surface, and wherein each through hole is sealed by a solder bump ( 214 ) on the second main surface such that the ultrasound transducer arrangement can be directly mounted on the flexible tubular body without the need for a PCB.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/326,055, filed Jan. 13, 2017, which is the U.S. National Phaseapplication under 35 U.S.C. § 371 of International Application No.PCT/EP2015/064365, filed on Jun. 25, 2015, which claims the benefit ofEP Application Serial No. 14177454.7 filed Jul. 17, 2014. Theseapplications are hereby incorporated by reference herein.

FIELD OF THE INVENTION

The present invention relates to an ultrasound transducer arrangementcomprising a plurality of substrate islands spatially separated andelectrically interconnected by a flexible polymer assembly.

The present invention further relates to an ultrasound transducerassembly including such an ultrasound transducer arrangement.

The present invention yet further relates to a coaxial wire assembly formating with the ultrasound transducer assembly.

The present invention still further relates to an ultrasound probeincluding such an ultrasound transducer assembly and coaxial wireassembly.

The present invention even still further relates to an ultrasoundimaging system including such an ultrasound probe.

BACKGROUND OF THE INVENTION

IC dies including ultrasound sensing capabilities, e.g. ultrasonictransducer chips, are increasingly used as a sensing tip of anultrasound probe such as an ultrasound catheter. The ultrasound sensingcapabilities may for instance be provided by a plurality of transducerelements in a main surface of the ultrasonic transducer chip, e.g. toprovide a forward looking or sideward looking ultrasound probe. Populartechnologies to implement the transducer elements include piezoelectrictransducer elements formed of materials such as lead zirconate titanate(PZT) or polyvinylidenefluoride (PVDF) and capacitive micro-machinedultrasonic transducer (CMUT) elements. An ultrasonic transducer chipbased on such CMUT elements is sometimes referred to as a CMUT device.

CMUT devices are becoming increasingly popular because CMUT devices canoffer excellent bandwidth and acoustic impedance characteristics, whichmakes them the preferable over e.g. piezoelectric transducers. Vibrationof the CMUT membrane can be triggered by applying pressure (for exampleusing ultrasound) or can be induced electrically. Electrical connectionto the CMUT device, often by means of an integrated circuit (IC) such asan application specific integrated circuit (ASIC) facilitates bothtransmission and reception modes of the device. In reception mode,changes in the membrane position cause changes in electricalcapacitance, which can be registered electronically. In transmissionmode, applying an electrical signal causes vibration of the membrane. Apressure causes a deflection of the membrane that is electronicallysensed as a change of capacitance. A pressure reading can then bederived.

Miniaturization is a particular challenge when developing ultrasoundprobes. In particular, where such probes are to be used for advanceddiagnostic purposes, e.g. cardiac investigations and surgery, suchprobes must be as small as possible to allow the probe to enter the bodypart of interest. At the same time, the ultrasound probe should berigid, e.g. when used as the tip of a catheter to allow the probe to beguided into the body part of interest in a controlled manner. Theserequirements are difficult to reconcile with the desire to includesignificant signal processing capability at the probe.

Specifically, it may be desirable to include active components, e.g.application specific integrated circuits (ASICs) at the probe tip toprovide the ultrasound transducer cells with control signals and toprocess the response signals, as well as passive components such asdecoupling capacitors that for instance protect the various circuitsfrom fluctuations in the supply voltage, e.g. supply bounce, which canbe caused by the power consumption behaviour some of the components, inparticular the ASICs.

US 2010/0280388 A1 discloses a CMUT array mounted on a flexible membertogether with support electronics. This subassembly can be rolled into atube (cylinder) to form a CMUT based ultrasonic scanner, whereinultrasound transducers are distributed over the side surface of saidcylinder. However, it is not straightforward to achieve a sufficientlycompact ultrasonic scanner in this manner. Specifically, in order tomount the subassembly onto a catheter lumen, the subassembly istypically connected to a printed circuit board (PCB) carrying furthersupport electronics such as discrete components, e.g. decouplingcapacitors, that cannot be readily formed in the subassemblymanufacturing process, e.g. because these components are manufactured ina different technology. The PCB is connected to a number of coaxialwires inside the lumen, the number typically matching the number ofchannels of the ultrasonic scanner. Such a PCB gives the desiredrigidity to the ultrasonic scanner. However, the minimum dimensions ofthe PCB and discrete components typically preclude sufficientminiaturization to facilitate use of such probes in dimensionallychallenging environments, e.g. cardiac environments. Yet anotherdisadvantage of the array shown is US 2010/0280388 A1 is its limitedfield of view in the forward looking direction.

SUMMARY OF THE INVENTION

The present invention seeks to provide an ultrasound transducer assemblythat obviates the need for a separate PCB.

The present invention seeks to provide a coaxial wire assembly that canbe connected to such an ultrasound transducer assembly in astraightforward manner.

The present invention further seeks to provide an ultrasound probeincluding such an ultrasound transducer assembly and coaxial wireassembly connected to each other.

The present invention yet further seeks to provide an ultrasonic imagingsystem including such an ultrasound probe.

According to an aspect, there is provided a foldable ultrasoundtransducer arrangement comprising a plurality of substrate islandsspatially separated and electrically interconnected by a flexiblepolymer assembly including electrically conductive tracks providing saidelectrical interconnections, said plurality including a first substrateisland comprising a plurality of ultrasound transducer cells and asecond substrate island comprising an array of external contacts forconnecting the ultrasound sensor arrangement to a flexible tubular body;and a rigid support structure having a first planar portion comprising afirst surface, a second planar portion opposite the first portion havinga second surface and a third planar portion having a third surfaceextending between the first surface and the second surface, wherein thefoldable ultrasound transducer arrangement is arranged to be folded ontothe support structure such that the first substrate island is mounted onthe first surface and the second island is mounted on the secondsurface.

The present invention is based on the insight that some embodiments of aflexible transducer arrangement may be provided that can be folded ontoa pre-shaped rigid carrier (structure) such that the transducerarrangement can be directly connected to a set of coaxial wires withoutrequirement of an interconnecting PCB. Consequently, a particularlycompact transducer assembly may be produced that can be used in anultrasound probe for a flexible tubular body such as a catheter. Inaddition the first substrate island comprising a plurality of ultrasoundtransducer cells may provide a high density ultrasound array capable ofacquiring high resolution ultrasound images in a forward lookingdirection away from the first surface of the rigid support structure.

Advantageously, the ultrasound transducer assembly further comprises atleast one further substrate island comprising a plurality of externalcontacts for receiving active and/or passive components. This furtherobviates the need for a separate PCB as the further substrate islandscan act as mounting pads for such active components, e.g. ASICs, and/orpassive components, e.g. decoupling capacitors.

In an embodiment, at least one of the first substrate island, the secondsubstrate island and the at least one further substrate island comprisesa plurality of trenches defining a decoupling capacitor, each trenchbeing filled by a conductive material separated from the substratematerial by an electrically insulating material. Such an embeddedvertical or trench capacitor may have a large plate area due to thethree-dimensional nature of such a capacitor and may therefore functionas a decoupling capacitor, thus obviating the need for discretecapacitors. This further reduces the overall size of the ultrasoundtransducer arrangement as discrete decoupling capacitors are typicallyrelatively large and in some application domains are too large tofacilitate sufficient miniaturization of the ultrasound transducerarrangement.

The ultrasound transducer arrangement may comprise a plurality of saiddecoupling capacitors, each decoupling capacitor being located on adifferent substrate island. This has the further advantage that therespective decoupling capacitors are truly electrically insulated fromeach other, such that different decoupling capacitors may be operated atdifferent potentials, i.e. the substrates may be operated at differentpotentials. This increases the operational flexibility and robustness ofthe ultrasound transducer arrangement.

In an alternative embodiment, the flexible polymer assembly is astrip-shaped assembly and the first substrate island and the secondsubstrate island are at opposite ends of the strip-shaped assembly, theultrasound transducer arrangement further comprising a plurality ofsupport islands in between the first substrate island and the secondsubstrate island, the respective substrate and support islands beinginterconnected by the flexible polymer assembly.

This allows for the formation of a compact rigid ultrasound transducerassembly in which the need for a separate PCB or pre-shaped rigidcarrier can be avoided.

The ultrasound transducer arrangement may further comprise at least onefurther substrate island comprising a plurality of external contacts forreceiving active and/or passive components, said at least one furthersubstrate island being mounted on the third planar portion. Due to theplanar nature of the second surface in between the first surface and thethird surface, such components can be added to the ultrasound transducerarrangement whilst retaining a compact arrangement. The ultrasoundtransducer may include active and/or passive components mounted on theat least one further substrate island.

The rigid support structure may be a metal support structure. Thisprovides a particularly rigid support structure than can be manufacturedat low cost.

The first substrate island may be separated from the first surface by abacking member in order to insulate the ultrasound transducer cells fromscattered ultrasound waves from undesirable directions.

According to another aspect, there is provided an ultrasound transducerassembly comprising a backing member; and the ultrasound transducerarrangement according to the alternative embodiment, wherein the firstsubstrate island is mounted on a first surface of the backing member andsaid strip-shaped assembly is folded to define a plurality of meanderingfolds mounted on a second surface of the backing member opposite saidfirst surface, wherein the folds are dimensioned such that neighbouringsupport islands are adhered together within a single fold, and whereinthe second substrate island is exposed at a distal end of the foldedstrip-shaped assembly relative to the backing member. This provides acompact and rigid ultrasound transducer assembly without requiring aseparate rigid support structure.

According to yet another aspect, there is provided a coaxial wireassembly comprising a plurality of coaxial wires each having aconductive core covered by an electrically insulating sleeve; and aelectrically insulating body having a first main surface, a second mainsurface and a plurality of through holes each extending from the firstmain surface to the second main surface, each of said holes being coatedwith an electrically conductive member; wherein each coaxial wirecomprises an exposed terminal core portion mounted in one of said thoughholes from the first main surface, and wherein each through hole issealed by a solder bump on the second main surface.

By securing the coaxial wires in a connection pad, which may forinstance act as a ball grid array, a connection between the coaxialwires and the item to be connected thereto, e.g. the second substrateisland of the ultrasound transducer arrangement, can be made in a simpleand straightforward manner. To this end, the coaxial wire assembly mayfurther comprise a flexible tubular body such as a catheter lumenhousing said coaxial wires, wherein the electrically insulating body ismounted on an end portion of the flexible tubular body. However, itshould be understood that such a coaxial wire assembly is not limited toconnecting with the coaxial wire assembly of the present invention; sucha coaxial wire assembly may be connected to any item that requiresconnection to a plurality of coaxial wires. Specifically, the coaxialwire assembly may be connected to an edge portion of a carrier such as aPCB to facilitate a straightforward connection between the coaxial wireassembly and the carrier.

According to a further aspect, there is provided an ultrasound probecomprising one or more embodiments of the above ultrasound transducerassembly and the coaxial wire assembly, wherein each of the externalcontacts of the second substrate island is conductively coupled to oneof the solder bumps. This yields a particularly compact and rigidultrasound probe that can be reliably used in small spaces such ascardiac volumes.

According to a yet further aspect, there is provided an ultrasonicimaging system including such an ultrasound probe. Such an imagingsystem can be reliably used to produce images of small spaces ofinterest, such as cardiac volumes.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention are described in more detail and by way ofnon-limiting examples with reference to the accompanying drawings,wherein:

FIG. 1 schematically depicts an aspect of a coaxial wire assemblyaccording to an embodiment;

FIG. 2 schematically depicts another aspect of a coaxial wire assemblyaccording to an embodiment;

FIG. 3 schematically depicts a coaxial wire assembly according to anembodiment mounted onto an edge of a printed circuit board;

FIG. 4 schematically depicts an ultrasound transducer arrangementaccording to an embodiment;

FIG. 5 schematically depicts a rigid carrier onto which the ultrasoundtransducer arrangement of FIG. 4 can be mounted;

FIG. 6 schematically depicts an ultrasound transducer assembly accordingto an embodiment;

FIG. 7 schematically depicts an aspect of an ultrasound probe tipincluding an ultrasound transducer arrangement according to anotherembodiment;

FIG. 8 schematically depicts the ultrasound probe tip of FIG. 7 with theultrasound transducer arrangement in a folded arrangement;

FIG. 9 schematically depicts an example embodiment of a method ofmanufacturing an ultrasound transducer arrangement;

FIG. 10 schematically depicts a method of integrating trench capacitorsinto an ultrasound transducer arrangement according to an embodiment;and

FIG. 11 schematically depicts ultrasonic imaging system according to anexample embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

It should be understood that the Figures are merely schematic and arenot drawn to scale. It should also be understood that the same referencenumerals are used throughout the Figures to indicate the same or similarparts.

Embodiments of the present invention are directed to the provision of acompact and rigid ultrasound probe tip where the rigidity of the tip canbe provided without the need for a printed circuit board (PCB). To thisend, a plug and socket type arrangement has been devised in which anultrasound transducer assembly and a coaxial wire assembly are directlymated to connect the ultrasound transducer assembly to a flexible lumensuch as a flexible catheter, in contrast to prior art arrangements inwhich the ultrasound transducer assembly is typically mounted to a PCBonto which the coaxial wires are soldered. As previously explained,these prior art arrangements cannot achieve the desired miniaturizationof the ultrasound probe tip due to the size constraints of the PCB.

FIGS. 1 and 2 schematically provide respective perspective views of acoaxial wire assembly 200 according to an embodiment. The coaxial wireassembly 200 comprises a plurality of coaxial wires 220 each having aconductive core 228 covered by an electrically insulating sleeve 226.The electrically insulating sleeve 226 typically separates theelectrically conductive core 228 from an electrically conductive outersheath 224, which is electrically insulated by an outer sleeve 222. Assuch coaxial wires 220 are well known per se, this will not be explainedin further detail. It is however noted for the avoidance of doubt thatany suitable type of coaxial wire may be used in the coaxial wireassembly 200.

The coaxial wire assembly further comprises an electrically insulatingbody 210 having a first main surface 211, a second main surface 213 anda plurality of through holes 212 each extending from the first mainsurface 211 to the second main surface 213. Each of said through holes212 is coated with an electrically conductive member, e.g. a metal ormetal alloy layer which may be applied to the inner surface of thethrough holes 212 in any suitable manner, e.g. by any suitable platingtechnique. The through holes 212 may be formed in the electricallyinsulating body 210 in any suitable manner, for instance using asuitable etch recipe. The electrically insulating body 210 may be madeof any suitable material, such as for instance undoped silicon or anyother electrically insulating material through which the through holes212 may be formed in a suitable manner, e.g. any electrically insulatingmaterial that can be etched to form the through holes 212. Each coaxialwire 220 comprises an exposed terminal core portion where theelectrically insulating sleeve 226 has been stripped back to expose theterminal core portion. Each exposed terminal core portion is mounted inone of the though holes 212 such that the terminal core portion entersthe through hole 212 from the first main surface 211. Each terminal coreportion is secured in its through hole 212 such that the terminal coreportion is electrically coupled to the electrically conductive memberinside the through hole 212. For instance, the terminal core portion maybe secured in the through hole 212 using a solder. Each through hole 212may be further sealed by a solder bump (not shown) on the second mainsurface 213, which solder bumps may define a ball grid array on thesecond main surface 213. The solder bump may form part of the soldersecuring the terminal core portion inside the through hole 212.Alternatively, the electrically conductive member formed inside eachthrough hole 212 may be shaped such that the electrically conductivemembers protrude from the second main surface 213, which protrusions mayinstead define an array of contacts on the second main surface 213. Inan embodiment, the coaxial wires 220 form part of a flexible lumen suchas a catheter, wherein the coaxial wires 220 are typically housed withina flexible tubular body as is well known per se. In this embodiment, thearray of contacts, e.g. a ball grid array, may be used to directlyconnect the flexible lumen to an ultrasound transducer assembly, i.e.without the need to connect the coaxial wires 220 to a PCB, as will beexplained in more detail later.

However, it should be understood that the coaxial wire assembly 200 isnot limited to such a use. The coaxial wire assembly 200 may be used asa coaxial wire connection to any further assembly that requires aplurality of coaxial wires to be connected thereto. In particular, thecoaxial wire assembly 200 may be advantageously used in devices in whichthe coaxial wires 220 are to be connected in relatively close vicinityto each other, where the required close vicinity makes it difficult toreliably establish the desired interconnections on an individual basis.For instance, the coaxial wire assembly 200 according to embodiments canfacilitate a connection matrix of coaxial wires 220 having a pitch of200 microns or less.

FIG. 3 schematically depicts an example in which the coaxial wireassembly 200 is mounted to a PCB 300 carrying one or more discretecomponents 310. Here, the coaxial wire assembly 200 is electricallycoupled, e.g. soldered or glued using drops of a conductive glue betweenopposing contacts, to an edge portion of the PCB 300. Such an edgearrangement is particularly compact and may be achieved because thecoaxial wire assembly 200 may have an overall height of about 1 mm orless, which is well within the thickness of most PCBs. More generally,the form factor of the coaxial wire assembly 200 makes it particularsuitable for connection to an edge portion of a further assembly, wherethe edge portion connects two opposing major surfaces of the furtherassembly.

In a specific embodiment, the coaxial wire assembly 200 may form part ofa flexible lumen, e.g. a catheter, and may be used to form a compactrigid probe tip with an ultrasound transducer arrangement, where theultrasound transducer arrangement is designed to comprise a substrateisland comprising an array of external contacts for connecting theultrasound sensor arrangement to the catheter via the coaxial wireassembly 200 without the need for an intermediary rigid carrier such asa PCB in between the ultrasound transducer arrangement and the coaxialwire assembly 200.

FIG. 4 schematically depicts an ultrasound transducer arrangement 100according to such an embodiment. The ultrasound transducer arrangement100 typically comprises an ultrasonic transducer substrate island orchip 110 having a major surface comprising an ultrasound transducerarea, which typically comprises a plurality of transducer elements, suchas CMUT or PZT elements. In a preferred embodiment, the major surfacecomprises an ultrasound transducer area formed by a plurality of CMUTelements.

The major surface further comprises a plurality of contacts, which mayprovide points of contact to the transducer elements in any suitablemanner as is well-known per se. Any suitable embodiment of such atransducer substrate island or chip 110 may be chosen; it should beunderstood that embodiments of the present invention are not limited toa particular embodiment of such a transducer chip. For instance, thetransducer chip 110 may be realized in any suitable semiconductortechnology, e.g. CMOS, BiCMOS, bipolar technology and so on, using anysuitable semiconductor substrate material, e.g. silicon,silicon-on-insulator, SiGe, GaAs and so on. Moreover, it should beunderstood that the transducer substrate island or chip 110 is shown asa circular chip by way of non-limiting example only; the transducersubstrate island or chip 110 may take any suitable shape or form.

The ultrasonic transducer assembly further comprises a contact substrateisland or chip 120 spatially separated from the transducer substrateisland or chip 110 by a flexible polymer assembly 150 including, e.g.,embedding, conductive tracks between the transducer substrate island orchip 110 and the contact substrate island or chip 120. The contact chip120 typically comprises a plurality of external contacts 420 forengaging with the coaxial wire assembly 200 as will be explained in moredetail later. Any suitable embodiment of such a contact substrate islandor chip 120 may be chosen; it should be understood that embodiments ofthe present invention are not limited to a particular embodiment of sucha contact chip. For instance, the contact chip 120 may be realized inany suitable semiconductor technology, e.g. CMOS, BiCMOS, bipolartechnology and so on, using any suitable semiconductor substratematerial, e.g. silicon, silicon-on-insulator, SiGe, GaAs and so on.

The external contacts may be realized in any suitable electricallyconductive material, such as any material that is commonly used for theformation of such contacts, e.g. any suitable metal or metal alloy. Inan embodiment, the external contacts 420 carry a solder bump forestablishing the electrical connection with the coaxial wire assembly200.

The flexible polymer assembly 150 may for instance be formed of anelectrically insulating flexible polymer such as polyimide, wherein theconductive tracks may be formed by depositing a metal layer such as acopper layer over the electrically insulating flexible polymer andpatterning the metal layer to form the conductive tracks. In anembodiment, the flexible interconnect 150 may be a Flex foil or acopper-coated polyimide such as a Pyralux® foil as marketed by the DuPont company.

In the embodiment shown in FIG. 4, the ultrasonic transducer substrateisland or chip 110 and the contact substrate island or chip 120 may bediscretely manufactured chips, e.g. chips manufactured in differentmanufacturing processes using different technologies, which chips areinterconnected to each other by the flexible polymer assembly 150 aftersingulation. This has the advantage of increased flexibility in thedesigns of the ultrasonic transducer chips 110 and the contact chips120, but comes at the cost of a more involved assembly process of theultrasonic producer assembly, as it can be cumbersome to connect theflexible interconnect 150 to the respective chips 110, 120. Therefore,in an alternative embodiment, which will be explained in more detaillater with the aid of FIG. 9, the ultrasonic transducer substrate islandor chip 110, the contact substrate island or chip 120 and the flexiblepolymer assembly 150 may be produced in a single (integrated) productionprocess.

The ultrasound transducer arrangement 100 may further comprise one ormore mounting substrate islands or chips 130, which may be realized inthe same technology as the ultrasonic transducer substrate island orchip 110 and/or the contact substrate island or chip 120, i.e. in asingle integrated production process, or in a distinct technology aspreviously explained. The one or more mounting substrate islands orchips 130 are electrically connected to the ultrasonic transducersubstrate island or chip 110 and/or the contact substrate island or chip120 through the conductive tracks in the flexible polymer assembly 150.The one or more mounting substrate islands or chips 130 comprisecontacts on an exposed surface onto which active components 132, e.g.transducer controllers and/or signal processing components such as ICs,e.g. application-specific ICs (ASICs), or passive components 134, e.g.decoupling capacitors or the like, may be mounted in any suitablemanner, e.g. soldered, thermo compression bonded, and so on. This hasthe advantage that discrete components may be added to the ultrasoundtransducer arrangement 100 without having to manufacture thesecomponents in the same technology as for instance the ultrasonictransducer substrate island or chip 110. This increases the designflexibility of the ultrasound transducer arrangement 100. The at leastone mounting substrate island or chip 130 in essence serves as areplacement mounting platform for such discrete components, therebyfacilitating the omission of a PCB from an ultrasound transducerassembly including the ultrasound transducer arrangement 100.

It should however be understood that embodiments the present inventionare not limited to such discrete components being mounted on dedicatedsubstrate islands 130; it is equally feasible that the ultrasonictransducer substrate island or chip 110 and/or the contact substrateisland or chip 120 contain such external contacts for mounting suchdiscrete components in addition to or instead of on the mountingsubstrate islands or chips 130.

In the absence of such a PCB, additional measures are required to ensurethat the ultrasound transducer assembly achieves the desired stiffnesswhen used as a probe tip of e.g. an invasive diagnostic device such as acatheter. In a first embodiment, the ultrasound transducer arrangement100 may be mounted on a pre-shaped rigid support structure 400, anexample embodiment of which is schematically depicted in FIG. 5 to forman ultrasound transducer assembly 600 as schematically depicted in FIG.6. The rigid support structure 400 may have a first planar portion 410comprising a first surface for supporting the ultrasonic transducersubstrate island or chip 110, a second planar portion 420 opposite thefirst portion 410 having a second surface for supporting the contactsubstrate island or chip 120 and a third planar portion 430 having athird surface extending between the first surface and the second surfacefor supporting the one or more mounting substrate islands or chips 130,which one or more mounting substrate islands or chips 130 may carryactive components 132 and/or passive components 134 as previouslyexplained. The third planar portion may be aligned with an overalllength of a probe (while being perpendicular to the first and secondsurfaces), wherein such an assembly can be used. In an embodiment, bothmain surfaces of the third planar portion 430 may be used to supportmounting substrate islands or chips 130.

The ultrasound transducer arrangement 100 may be mounted on the rigidsupport 400 by folding the flexible polymer assembly 150 such that therelevant substrate islands are mounted on the aforementioned planarsurfaces. To this end, the flexible polymer assembly 150 may be shaped,e.g. patterned, to contain multiple flaps each carrying one or more ofthe substrate islands, which flaps are folded over the appropriateplanar surface of the rigid support structure 400 to form the rigidultrasound transducer assembly 600. The ultrasound transducerarrangement 100 may be secured on the rigid support structure 400 in anysuitable manner, e.g. using a suitable adhesive, which will be known perse to the person skilled in the art.

The rigid support structure 400 may be made of any suitable rigidmaterial, such as a rigid (bio)polymer, a metal, metal alloy, e.g.stainless steel, and so on. In an embodiment, the rigid supportstructure 400 is made of a rigid material that is cleared for internaluse in a patient, e.g. titanium or stainless steel. The rigid supportstructure 400 may take any suitable shape. In an embodiment, the firstsurface of the first planar portion 410 is substantially parallel withthe second surface of the second planar portion 420, wherein the firstsurface and second surface face opposite directions.

This for instance may be used to provide an ultrasound transducerassembly 600 having a forward looking ultrasound transducer array and acontact substrate island or chip 120 being arranged to connect to acoaxial wire assembly 100 mounted on a tip of a flexible tubular member,e.g. a lumen or catheter. Upon connection of such a ultrasoundtransducer assembly 600 to such a coaxial wire assembly 100, aparticularly compact probe tip can be achieved, e.g. having the overalllength from transducer chip 110 to contact chip 120 of less than 10 mm,or even less than 8 mm, with a high degree of rigidity, thus providingan ultrasound probe tip that is particularly suitable for investigationsand procedures involving small body volumes, e.g. cardiac investigationsand procedures. The advantage of such a probe comprising the forwardlooking ultrasound array located at its tip's front surface may becompact size and a capability of high resolution ultrasound imaging dueto the possibility in varying the transducer density within ultrasonictransducer substrate island 110.

Optionally, in the ultrasound transducer assembly 600 used for the probetip, the ultrasonic transducer chip 110 may be separated from the firstsurface of the first planar portion 410 by a backing member 610. In thisembodiment, at least a part of the flexible polymer assembly 150 mayextend along an outer side of the backing member 610, such that thetransducer chip 110 and the contact ship 120 are electricallyinterconnected. The backing member 610 typically comprises a resin suchas an epoxy resin in which ultrasound scattering and/or absorbing bodiesare included. For instance, the ultrasound scattering bodies and/orultrasound absorbing bodies may be dispersed in the resin. Such bodiessuppress or even prevent scattered and/or reflected ultrasound wavesfrom reaching the ultrasonic transducer elements of the ultrasonictransducer chip 110. This may improve the resolution of the ultrasoundimage generated by the ultrasonic transducer chip 110, as predominantlyor only ultrasound waves generated and reflected in the intendeddirection (e.g. forward generated and reflected ultrasound waves in thecase of a forward-looking ultrasound probe including the ultrasonictransducer chip 100) are detected by the ultrasonic transducer elementsof the ultrasonic transducer chip 100. In other words, the suppressionor prevention of ultrasound waves from other directions reaching theultrasonic transducer chip 110 by the backing member 610 reduces or evenavoids interference from such stray ultrasound waves with the ultrasoundwaves from the direction of interest.

Any suitable ultrasound scattering materials may be used to form theultrasound scattering bodies in the backing member 610. For instance, anon-limiting example of such an ultrasound scattering body is a hollowglass sphere although other suitable ultrasound scattering bodies willbe immediately apparent to the skilled person. Similarly, any suitablesolid materials may be used to form the ultrasound absorbing bodies. Itis well-known per se that heavy materials, e.g. materials based on heavymetals, are ideally suited for such a purpose. A non-limiting example ofsuch a material is tungsten. For instance, the ultrasound absorbingbodies may comprise tungsten, such as in the form of tungsten oxide.Again, it will be immediately apparent to the skilled person that manysuitable alternatives to tungsten are readily available, and suchsuitable alternatives are equally feasible to be used in the backingmember 610.

FIG. 7 schematically depicts an alternative embodiment of an ultrasoundtransducer arrangement 100 that can be folded into a rigid ultrasoundtransducer assembly 600 having a plurality of meandering folds asschematically shown in FIG. 8. In this embodiment, the flexible polymerassembly 150 is shaped as an elongated strip, wherein the ultrasoundtransducer arrangement 100 in addition to the ultrasonic transducersubstrate island or chip 110 and the contact substrate island or chip120 further comprises a plurality of support substrate islands or chips140 interconnected by the flexible polymer assembly 150 as previouslyexplained.

The support substrate islands or chips 140 are spaced apart such thatexposed major surfaces of neighbouring support substrate islands orchips 140 may be contacting each other when the flexible polymerassembly 150 is folded into a plurality of meandering loops or folds,with the neighbouring support substrate islands or chips 140 occupying asingle fold or loop as shown in FIG. 8. The neighbouring supportsubstrate islands or chips 140 may be secured to each other in anysuitable manner, e.g. using a suitable adhesive. The support substrateislands or chips 140 act as rigid support members of the ultrasoundtransducer assembly 600 that help to give the ultrasound transducerassembly 600 its desired rigidity.

In an embodiment, at least some of the support substrate islands orchips 140 may perform the role of the previously described mountingsubstrate islands or chips 130. In other words, at least some of thesupport substrate islands or chips 140 may comprise contacts on anexposed surface onto which active components 132, e.g. transducercontrollers and/or signal processing components such as ICs, e.g.application-specific ICs (ASICs), or passive components 134, e.g.decoupling capacitors or the like, may be mounted in any suitablemanner, e.g. soldered, thermo compression bonded, and so on.

In an embodiment, the ultrasound transducer substrate island or chip 110is spatially separated from a further substrate island, e.g. one of thesupport substrate islands or chips 140, by a backing member 610, whichmay be a backing member as previously explained. The ultrasoundtransducer substrate island or chip 110 and the further substrate islandmay be affixed to the backing member 610 in any suitable manner, e.g.using an adhesive.

The ultrasound transducer substrate island or chip 110 may be located ata proximal end and the contact substrate island or chip 120 may belocated at a distal end of the strip-shaped flexible polymer assembly150 relative to the backing member 610. As shown in FIG. 8, the contactsubstrate island or chip 120 may be connected to a coaxial wire assembly200 comprising a plurality of coaxial wires 220 as previously discussed.

In FIG. 9, a non-limiting example of a method in accordance with anembodiment of the present invention is schematically depicted in whichan ultrasound transducer arrangement 100 is formed. In a first step,depicted in FIG. 9(a), a wafer 900 is provided in which a plurality ofultrasonic transducer substrate islands or chips 110 having a pluralityof ultrasonic transducer elements 112 and a plurality of first contacts114 have been formed in one or more arrays 920 and in which contactsubstrate islands or chips 120 including a plurality of second contacts122 are formed in one or more arrays 930 (two arrays 920, 930 are shownby way of non-limiting example). The arrays 920 of the ultrasonictransducer substrate islands or chips 110 are separated from aneighbouring array 930 of the contact substrate islands or chips 120 bya sacrificial region 910 of the wafer 900. Individual substrate islandsor chips within each of the arrays 920, 930 are separated by a furthersacrificial wafer region 912, e.g. a scribe line or the like as will beexplained in more detail later.

The wafer 900 may be any suitable wafer, such as a silicon wafer, asilicon-on-insulator wafer or a wafer of other suitable semiconductormaterials. In an embodiment, the wafer 900 may comprise an etch stoplayer (not shown), such as an oxide layer. Its purpose will be explainedin more detail later. The first contacts 114 of each ultrasonictransducer substrate island or chip 110 are to be connected to thesecond contacts 122 of an opposing contact substrate island or chip 120by a flexible polymer assembly 150 extending across the sacrificialregion 910. Such a flexible contact extension can be seen as amicroscopic version of a flat cable, which use is well-known at theprinted circuit board (PCB) level.

The method proceeds as shown in FIG. 9(b) with the provision of a layerof a flexible and electrically insulating material 150 on the front sideof the wafer 900, which is subsequently patterned by photolithography toexpose the first and second contacts 114, 122 underneath the layer 200.Any suitable material may be used for the layer 200. The flexible andelectrically insulating material may be chosen from the group consistingof parylene, polyimide, polyimide resins, polycarbonate, fluorocarbon,polysulphon, epoxide, phenol, melamine, polyester, and silicone resinsor their co-polymers. Polyimide and parylene are particularly suitablewhen the IC is to be integrated into an invasive medical device as thesematerials have been cleared for use in invasive medical devices.

The thickness of the layer of a flexible and electrically insulatingmaterial 150 preferably is selected in the range from 1-20 μm and morepreferably in the range of 1-10 μm to ensure that the resultant hassufficient flexibility. If the layer 150 becomes too thick, itsflexibility will be reduced. However, if the layer 150 becomes too thin,it may be damaged too easily.

In a subsequent step, shown in FIG. 9(c), a conductive material isdeposited on the layer of the flexible and electrically insulatingmaterial 150 and subsequently patterned to provide respective conductivetracks 152 in conductive contact with the exposed first and secondcontacts 114, 122 underneath the layer 150. Any suitable electricallyconductive material, such as Al, Cu or other suitable metals and metalalloys may be used.

In an optional step shown in FIG. 9(d), the conductive tracks 152 aresubsequently covered with a second layer of a flexible and electricallyinsulating material 150′, which preferably is the same material as usedfor layer 150, although this is not essential. In other words, thematerials used for layers 150 and 150′ respectively may be individuallyselected from the previously described group of suitable compounds.

In a preferred embodiment, layers 150 and 150′ are made of the samematerial, e.g. polyimide or parylene, and have the same thickness, e.g.approximately 5 μm. By using the same thickness for both layers 150 and150′, the conductive track(s) 152 are situated at the so called neutralline of stress of the flexible contact extension of the contacts 114,122. If present, the second layer 150′ of a flexible and electricallyinsulating material may be covered with a thin protective layer (notshown) from subsequent wafer processing steps. Any suitable material,such as a metal, e.g. Al may be used. The use of a material that canserve both to protect the layer 150′ during the subsequent processingsteps as well as a hard-etch mask for the subsequent patterning of thesecond layer of a flexible and electrically insulating material 150′ ispreferred as it reduces the wafer processing complexity. For thisreason, metals such as Al are preferred.

As shown in FIG. 9(e), the method proceeds by applying and patterning aresist layer 902 on the backside of the wafer 900. Alternatively theresist layer 902 may be replaced by a patterned hard mask. The patternedresist layer 902, which may be any suitable material including a similaror the same material used for the previously mentioned thin protectivelayer over the second layer 150′, protects (covers) the areas of thearrays 920, 930 in the wafer 500.

In a final step, shown in FIG. 9(f), the exposed parts of the back-sideof the wafer 900, i.e. the parts not covered by the patterned resist 902are exposed to an etch recipe, preferably an anisotropic etch recipesuch as the Bosch process, for instance in case of the wafer 900 being asilicon wafer, with the exposed parts being etched to a depthcorresponding to the intended final thickness of the substrate islandsor chips 110, 120 to be formed from the wafer 900, to release(singulate) the arrays 920, 930, with each array 920 connected to anarray 530 by the flexible interconnect 200. It is noted that the Boschprocess, which typically comprises consecutive etching and passivationsteps, is well-known per se, and will therefore not be explained infurther detail for reasons of brevity only. Other suitable etch recipesof course may also be contemplated. The patterned resist 902 issubsequently stripped from the backside of the wafer 900.

Although not specifically shown, a further singulation step may beemployed to singulate the ultrasound transducer arrangements 100, e.g.by dicing the sacrificial regions 912. Alternatively, the etch stepshown in step (f) may include the removal of the sacrificial regions 912such that the ultrasound transducer arrangements 100 are individualizedin a single step process.

At this point, it is noted that the wafer 900 may of course includefurther substrate islands, e.g. mounting substrate islands 130 and/ordummy substrate islands 140, which, were necessary, may be connected tothe ultrasonic transducer substrate islands or chips 110 and/or thecontact substrate islands or chips 120 as explained above for theelectrical connection between the contacts 114, 122. These furthersubstrate islands have not been shown for reasons of clarity only.

It is further noted that the contact substrate islands or chips 120further comprise a plurality of external contacts for connecting thecontact substrate islands or chips 120 to coaxial wire assemblies 200 aspreviously explained. Again, these external contacts may be formed inany suitable manner and have not been shown for reasons of clarity only.In an embodiment, solder bumps may be formed on these external contacts.The solder bumps may be formed on the external contacts at any suitablepoint in the aforementioned manufacturing process, for instance beforeor after the singulation of the arrays 520, 530. The solder bumps may beformed on the contacts in any suitable manner, for instance by using alaser process as available from the PacTech Company, Nauen, Germany.

As previously mentioned, the ultrasound transducer arrangement 100 mayinclude passive components 134 such as one or more capacitors, e.g.decoupling capacitors. Such decoupling capacitors are typicallynecessary if the ultrasound transducer arrangement 100 comprisescomponents that produce switching transients that are large enough tocompromise the integrity of the power supply. An example of such acomponent is a signal processing IC such as an ASIC. This problem isparticularly prevalent at a miniature probe tip where the power supplylines tend to have a relatively high and undefined impedance. In such ascenario, decoupling capacitors are used to decouple various componentsfrom the power supply lines such that these components are shielded fromfluctuations in the power supply. Such decoupling capacitors havecapacitances typically ranging from 1 to 100 nF. Furthermore, discretecapacitors may be included to establish an AC connection betweendifferent circuit parts operating at different DC potentials, e.g. inthe case of a CMUT transducer array and an ASIC. Such a capacitor mustbe electrically floating, i.e. must be dielectrically insulated from thesubstrate and ground.

The size of such discrete capacitors is such that integration in aminiaturized ultrasound probe tip is prohibited as such capacitors aresimply too big. In an embodiment, this problem is addressed by theintegration of trench capacitors in at least some of the substrateislands 110, 120, 130, such that the need for the inclusion of discretecapacitors in the ultrasound transducer arrangement 100 is obviated.

Advantageously, the ultrasound transducer arrangement 100 comprises aplurality of substrate islands at least including a first substrateisland 110 comprising a plurality of ultrasound transducer cells 112 anda second substrate island 120 comprising an array of external contactsfor connecting the ultrasound sensor arrangement to a flexible tubularbody, with the plurality of substrate islands optionally furthercomprising at least one mounting substrate island 130 for mounting oneor more active and/or passive components thereon as previouslyexplained. In an embodiment, at least two of these substrate islandseach comprise such a trench capacitor, which has the advantage that therespective trench capacitors are truly electrically isolated from eachother due to the fact that they are located in different substrates,such that these different substrates can be operated at differentpotentials. Moreover, the inclusion of the trench capacitors obviatesthe need for discrete capacitors to be included in the ultrasoundtransducer arrangement 100, thereby further aiding the miniaturizationof the ultrasound transducer arrangement 100 and an ultrasound probe tipformed from such an arrangement.

In the context of the present application, a trench capacitor is acapacitor formed by a plurality of trenches extending more or lessperpendicularly from a major surface of the substrate into thesubstrate. The trenches may have any suitable shape, e.g. outline, e.g.the trenches may be square, rectangular, circular trenches and so on.The substrate typically is a conducting or semiconducting substrate andacts as the first plate of the trench capacitor. The trenches aretypically lined with an electrical insulator, e.g. a dielectricmaterial, and filled with a further conductive or semiconductivematerial acting as the second plate of the trench capacitor, wherein theelectrical insulator separates the first plate from the second plate.Due to the fact that the plates of the trench capacitor extend in allthree dimensions and are formed by multiple trenches, a capacitor isobtained that have a large plate area in a compact substrate volume,thereby achieving a compact high capacity capacitor.

FIG. 10 schematically depicts an example embodiment of a method ofmanufacturing such a trench capacitor. It should be understood thatalternative manufacturing methods are readily available and will beknown to the skilled person. Such alternative manufacturing methods mayalso be contemplated.

The method begins in step (a) with the provision of a conductivesubstrate 1000, which may be a part of a wafer 900 and may be convertedinto one of the aforementioned substrate islands 110, 120, 130 aspreviously explained, for instance with the aid of FIG. 9. Theconductive substrate 1000 for instance may be a highly conductivesilicon substrate, such as an n-type substrate, e.g. an As-dopedsubstrate although p-type substrates may also be used. Also, substratematerials other than silicon may be contemplated as previouslyexplained. A suitable etch-mask 1002 is formed on the substrate 100 forinstance by growing a thermal oxide on the substrate 1000, which thermaloxide is opened to create openings 1004 where the trenches of the trenchcapacitor are to be formed. The etch-mask 1002 may be formed to anysuitable thickness, e.g. about 1 μm.

Next, as shown in step (b), the trenches 1006 are etched using asuitable etch recipe, e.g. using Deep Reactive Ion Etching in case of asilicon substrate 1000. The trenches 1006 may be etched to a depth ofabout 50-60% of the final thickness of the substrate island to beformed. For instance, for a substrate island having a final thickness ofabout 50 μm, the trenches 1006 may be etched to a depth of about 30 μmThe trenches 1006 may have any suitable width, such as a width of about1-2 μm.

After etching of the pores 1006, a capacitor dielectric 1008 isdeposited in step (c). Any suitable dielectric material may be used forthis purpose. A particularly suitable material is silicon nitride, whichfor instance may be deposited using LPCVD. However, other dielectricmaterials such as silicon oxide, aluminium oxide or combinations ofthese materials may also be used, and other deposition techniques, e.g.ALD, may also be contemplated. The capacitor dielectric 1008 may beformed to any suitable thickness, e.g. several tens of nm, e.g. 20 nm.

In step (d), the trenches 1006 lined with the capacitor dielectric 1008are filled with a conductive material 1010 to form the second plate ofthe trench capacitor. In an embodiment, the trenches 1006 may be filledby depositing a layer of in-situ doped poly-silicon although otherconductive materials may also be used. After patterning the conductivematerial 1010, e.g. using a suitable etch recipe in step (e), a furtherdielectric layer 1012 is formed over the patterned conductive material1010 in step (f) to electrically isolate the conductive material 1010from subsequent metallization steps. The manufacturing of the trenchcapacitor is completed by the etching of contact windows 1014, 1016 instep (g) and the deposition and patterning of a metal interconnect layersuch as an aluminium interconnect layer in step (h) to form metalcontacts 1020 and 1022 to the first plate and second plate of the trenchcapacitor respectively. As such finalization steps are well-known per sethey are not explained in further detail for the sake of brevity only.

As will be clear to the skilled person, the substrate 1000 may besubsequently subjected to further processing steps, e.g. to form anarray of transducer elements thereon. For instance, a passivation layeror layer stack may be formed on the trench capacitor after which anarray of ultrasonic transducer elements, e.g. CMUT elements may beformed on the passivation layer (stack) as is well known per se. Otherfurther processing steps, e.g. the formation of other elements on such asubstrate, will be apparent to the skilled person. It should further beunderstood that each substrate island may comprise a plurality of suchtrench capacitors.

Referring to FIG. 11, an example embodiment of an ultrasonic diagnosticimaging system with an array transducer probe according to an embodimentof the present invention is shown in block diagram form. In FIG. 11 aCMUT transducer array 110 on an ultrasound transducer chip 100 (notshown in FIG. 11) is provided in an ultrasound probe 10 for transmittingultrasonic waves and receiving echo information. The transducer array110 may alternatively comprise piezoelectric transducer elements formedof materials such as lead zirconate titanate (PZT) orpolyvinylidenefluoride (PVDF). The transducer array 110 may be a one- ora two-dimensional array of transducer elements capable of scanning in a2D plane or in three dimensions for 3D imaging.

The transducer array 110 is coupled to a microbeam former 12 in theprobe 10 which controls transmission and reception of signals by theCMUT array cells or piezoelectric elements. Microbeam formers arecapable of at least partial beam forming of the signals received bygroups or “patches” of transducer elements for instance as described inU.S. Pat. No. 5,997,479 (Savord et al.), U.S. Pat. No. 6,013,032(Savord), and U.S. Pat. No. 6,623,432 (Powers et al.).

The microbeam former 12 is coupled by the probe cable, e.g. coaxial wire410, to a transmit/receive (T/R) switch 16 which switches betweentransmission and reception and protects the main beam former 20 fromhigh energy transmit signals when a microbeam former is not present orused and the transducer array 110 is operated directly by the mainsystem beam former 20. The transmission of ultrasonic beams from thetransducer array 110 under control of the microbeam former 12 isdirected by a transducer controller 18 coupled to the microbeam formerby the T/R switch 16 and the main system beam former 20, which receivesinput from the user's operation of the user interface or control panel38. One of the functions controlled by the transducer controller 18 isthe direction in which beams are steered and focused. Beams may besteered straight ahead from (orthogonal to) the transducer array 110, orat different angles for a wider field of view. The transducer controller18 may be coupled to control a DC bias control 45 for the CMUT array.For instance, the DC bias control 45 sets DC bias voltage(s) that areapplied to the CMUT cells 150 of a CMUT array 110.

The partially beam-formed signals produced by the microbeam former 12are forwarded to the main beam former 20 where partially beam-formedsignals from individual patches of transducer elements are combined intoa fully beam-formed signal. For example, the main beam former 20 mayhave 128 channels, each of which receives a partially beam-formed signalfrom a patch of dozens or hundreds of CMUT transducer cells 112 (seeFIG. 1-3) or piezoelectric elements. In this way the signals received bythousands of transducer elements of a transducer array 110 cancontribute efficiently to a single beam-formed signal.

The beam-formed signals are coupled to a signal processor 22. The signalprocessor 22 can process the received echo signals in various ways, suchas bandpass filtering, decimation, I and Q component separation, andharmonic signal separation which acts to separate linear and nonlinearsignals so as to enable the identification of nonlinear (higherharmonics of the fundamental frequency) echo signals returned fromtissue and microbubbles.

The signal processor 22 optionally may perform additional signalenhancement such as speckle reduction, signal compounding, and noiseelimination. The bandpass filter in the signal processor 22 may be atracking filter, with its passband sliding from a higher frequency bandto a lower frequency band as echo signals are received from increasingdepths, thereby rejecting the noise at higher frequencies from greaterdepths where these frequencies are devoid of anatomical information.

The processed signals are coupled to a B-mode processor 26 andoptionally to a Doppler processor 28. The B-mode processor 26 employsdetection of an amplitude of the received ultrasound signal for theimaging of structures in the body such as the tissue of organs andvessels in the body. B-mode images of structure of the body may beformed in either the harmonic image mode or the fundamental image modeor a combination of both for instance as described in U.S. Pat. No.6,283,919 (Roundhill et al.) and U.S. Pat. No. 6,458,083 (Jago et al.)

The Doppler processor 28, if present, processes temporally distinctsignals from tissue movement and blood flow for the detection of themotion of substances, such as the flow of blood cells in the imagefield. The Doppler processor typically includes a wall filter withparameters which may be set to pass and/or reject echoes returned fromselected types of materials in the body. For instance, the wall filtercan be set to have a passband characteristic which passes signal ofrelatively low amplitude from higher velocity materials while rejectingrelatively strong signals from lower or zero velocity material.

This passband characteristic will pass signals from flowing blood whilerejecting signals from nearby stationary or slowing moving objects suchas the wall of the heart. An inverse characteristic would pass signalsfrom moving tissue of the heart while rejecting blood flow signals forwhat is referred to as tissue Doppler imaging, detecting and depictingthe motion of tissue. The Doppler processor receives and processes asequence of temporally discrete echo signals from different points in animage field, the sequence of echoes from a particular point referred toas an ensemble. An ensemble of echoes received in rapid succession overa relatively short interval can be used to estimate the Doppler shiftfrequency of flowing blood, with the correspondence of the Dopplerfrequency to velocity indicating the blood flow velocity. An ensemble ofechoes received over a longer period of time is used to estimate thevelocity of slower flowing blood or slowly moving tissue.

The structural and motion signals produced by the B-mode (and Doppler)processor(s) are coupled to a scan converter 32 and a multiplanarreformatter 44. The scan converter 32 arranges the echo signals in thespatial relationship from which they were received in a desired imageformat. For instance, the scan converter may arrange the echo signalinto a two dimensional (2D) sector-shaped format, or a pyramidal threedimensional (3D) image.

The scan converter can overlay a B-mode structural image with colorscorresponding to motion at points in the image field with theirDoppler-estimated velocities to produce a color Doppler image whichdepicts the motion of tissue and blood flow in the image field. Themultiplanar reformatter 44 will convert echoes which are received frompoints in a common plane in a volumetric region of the body into anultrasonic image of that plane, for instance as described in U.S. Pat.No. 6,443,896 (Detmer). A volume renderer 42 converts the echo signalsof a 3D data set into a projected 3D image as viewed from a givenreference point as described in U.S. Pat. No. 6,530,885 (Entrekin etal.) The 2D or 3D images are coupled from the scan converter 32,multiplanar reformatter 44, and volume renderer 42 to an image processor30 for further enhancement, buffering and temporary storage for displayon an image display 40. In addition to being used for imaging, the bloodflow values produced by the Doppler processor 28 and tissue structureinformation produced by the B-mode processor 26 are coupled to aquantification processor 34. The quantification processor producesmeasures of different flow conditions such as the volume rate of bloodflow as well as structural measurements such as the sizes of organs andgestational age. The quantification processor may receive input from theuser control panel 38, such as the point in the anatomy of an imagewhere a measurement is to be made.

Output data from the quantification processor is coupled to a graphicsprocessor 36 for the reproduction of measurement graphics and valueswith the image on the display 40. The graphics processor 36 can alsogenerate graphic overlays for display with the ultrasound images. Thesegraphic overlays can contain standard identifying information such aspatient name, date and time of the image, imaging parameters, and thelike. For these purposes the graphics processor receives input from theuser interface 38, such as patient name.

The user interface is also coupled to the transmit controller 18 tocontrol the generation of ultrasound signals from the transducer array110 and hence the images produced by the transducer array and theultrasound system. The user interface is also coupled to the multiplanarreformatter 44 for selection and control of the planes of multiplemultiplanar reformatted (MPR) images which may be used to performquantified measures in the image field of the MPR images.

As will be understood by the skilled person, the above embodiment of anultrasonic diagnostic imaging system is intended to give a non-limitingexample of such an ultrasonic diagnostic imaging system. The skilledperson will immediately realize that several variations in thearchitecture of the ultrasonic diagnostic imaging system are feasiblewithout departing from the teachings of the present invention. Forinstance, as also indicated in the above embodiment, the microbeamformer 12 and/or the Doppler processor 28 may be omitted, the ultrasoundprobe 10 may not have 3D imaging capabilities and so on. Othervariations will be apparent to the skilled person.

It should be noted that the above-mentioned embodiments illustraterather than limit the invention, and that those skilled in the art willbe able to design many alternative embodiments without departing fromthe scope of the appended claims. In the claims, any reference signsplaced between parentheses shall not be construed as limiting the claim.The word “comprising” does not exclude the presence of elements or stepsother than those listed in a claim. The word “a” or “an” preceding anelement does not exclude the presence of a plurality of such elements.The invention can be implemented by means of hardware comprising severaldistinct elements. In the device claim enumerating several means,several of these means can be embodied by one and the same item ofhardware. The mere fact that certain measures are recited in mutuallydifferent dependent claims does not indicate that a combination of thesemeasures cannot be used to advantage.

1. A transducer arrangement for an invasive diagnostic device,comprising: a flexible polymer assembly comprising electricallyconductive tracks; a plurality of transducer elements on a transducersubstrate island; and one or more support substrate islands comprisingapplication specific integrated circuits and capacitors, wherein thetransducer substrate island and the one or more support substrateislands are attached to the flexible polymer assembly.
 2. The transducerarrangement of claim 1, wherein the capacitors comprise decouplingcapacitors.
 3. The transducer arrangement of claim 1, wherein thecapacitors comprise trench capacitors formed within a plurality oftrenches extending into the one or more support substrate islands in asubstantially perpendicular direction with respect to a surface of acorresponding one of the one or more support substrate islands.
 4. Thetransducer arrangement of claim 3, wherein each of the trench capacitorscomprises a plurality of electrically connected trenches filled with adielectric material and an electrically conductive material.
 5. Thetransducer arrangement of claim 4, wherein a first electrode of acapacitor of the capacitors comprises the support substrate island onwhich the capacitor is located and a second electrode comprises theelectrically conductive material comprised within the trenches.
 6. Thetransducer arrangement of claim 3, wherein a depth of the trench is in arange of 50-60% of a thickness of the support substrate island on whicha corresponding capacitor of the capacitors is located.
 7. Thetransducer arrangement of claim 1, wherein each of at least two supportsubstrate islands comprises a decoupling capacitor.
 8. The transducerarrangement of claim 1, wherein the transducer elements comprisecapacitive micromachined ultrasound transducer elements.
 9. Thetransducer arrangement of claim 1, wherein the transducer elementscomprise lead zirconate titanate.
 10. The transducer arrangement ofclaim 1, wherein the transducer elements comprisepolyvinylidenefluoride.
 11. An ultrasound device comprising: a catheter;and a transducer arrangement comprising: a flexible polymer assemblycomprising electrically conductive tracks; a plurality of transducerelements on a transducer substrate island; and one or more supportsubstrate islands comprising application specific integrated circuitsand capacitors, wherein the transducer substrate island and the one ormore support substrate islands are attached to the flexible polymerassembly.